Electrochemical Study of Tantalum Plating in LiF–NaF–CaF2 Melt
M. Mehmood1,2, N. Kawaguchi1, Y. Sato1, T. Yamamura1, M. Kawai3 and K. Kikuchi4
1Department of Metallurgy, Graduate School of Engineering,
Tohoku University, Aoba-ku, Sendai 980–8579 (Japan)
E-mail: mazhar@material.tohoku.ac.jp
2Department of Chemical and Materials Engineering, Pakistan Institute of Engineering and Applied Sciences,
P.O. Nilore, Islamabad (Pakistan)
3High Energy Accelerator Research Organization, Tsukuba 305–0801 (Japan)
4Japan Atomic Energy Research Institute, Tokai, Ibaraki 319–1195 (Japan)
Страницы: 101-108
Аннотация
Investigation into electrodeposition of tantalum has been performed in LiF–NaF–CaF2 melt containing K2TaF7. In spite of large content of oxyfluorotantalate [TaOF5]2– in the melt, electrodeposition of compact tantalum coating has been possible. The CaF2 present in the electrolyte is responsible for removing the oxide ions from the electrode surface if these are released by electro-reduction of [TaOF5]2–. A conproportionation/disproportionation reaction that interferes with electrodeposition of tantalum has also been discovered in the fluoride melt. However, the conproportionation product is soluble in the melt, and it does not contaminate electrodeposited coating.
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